CIRCUIT BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board at a low cost by performing thermocompression bonding not necessarily require difference in melting points between films and by which shift of position of an electrical circuit on a base circuit board can be suppressed at the time of thermal crimping between a cover lay and the base circuit board. SOLUTION: In a method for manufacturing a circuit board, a base circuit board 5 is formed by placing an electrical circuit 4 formed of conductive members on the surface of a first thermoplastic liquid crystal polymer film 2. A second thermoplastic liquid crystal polymer film 3, whose melting point Tm( deg.C) is equal to or lower than that of the first thermoplastic liquid polymer film 2 is stacked on the base circuit board 5 and is cold pressed at a pressing temperature Tp( deg.C) within the range Tm-30<=Tp<=Tm-10 and at a pressing force P of 30 kg/cm2 or more for manufacturing a circuit board.