发明名称 AGGREGATIVE SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To suppress the breaking of a substrate in a manufacturing process by disposing unit substrates so that the slits may be shifted with the ones adjacent in the longitudinal direction of the unit substrates. SOLUTION: An aggreagative substrate 1 is made by arranging a plurality of rectangular unit substrates 2 which will become chip type resistors. Each of the unit substrates 2 has a rectangular shape extended in the longitudinal direction. The aggragative substrate 1 is partitioned by BB(bar break) slits 3 formed in the vertical direction and CB(chip break) slits 4 formed in the horizontal direction. The CB slits 4 are so formed as to be shifted with the ones adjacent in the longitudinal direction by shifting the unit substrates 2 from the ones adjacent in the longitudinal direction. Due to this structure, the bending force of the aggregative substrate 1 in the vertical direction can be increased and therefore the cracking of the aggregative substrate 1 can be suppressed in a manufacturing process.</p>
申请公布号 JP2000357604(A) 申请公布日期 2000.12.26
申请号 JP19990170421 申请日期 1999.06.17
申请人 ROHM CO LTD 发明人 TERAMAE TOSHIHIRO
分类号 H01C17/06;H05K1/02;H05K3/00;(IPC1-7):H01C17/06 主分类号 H01C17/06
代理机构 代理人
主权项
地址