| 摘要 |
PURPOSE:To select a semiconductor device in which only one piece of wire is open by applying a current of a smaller value than a value obtained by multiplying a fusing current value of one piece of bonding wire by the number of pieces of bonding wire, between a pad and a lead. CONSTITUTION:In the case when one wire W1 of two pieces of wires W1, W2 is open, a transistor is turned on and a current pulse of 1.5 folds of a fusing current value is conducted between a collector lead 2 and an emitter lead 3. Subsequently, all currents are applied to the connected wire W2, the wire W2 is fused, a characteristic measurement becomes impossible, and the device is selected and removed. |
