| 摘要 |
<p>A cooling head (5) projects from an underside of a cooling plate (11), and has a heat-conductive plate (17) fixed on its free end for thermal contact with an integrated circuit element. A nozzle (19) directs a jet (S) of cooling medium towards the heat-conductive plate (17) to cool the integrated circuit element by a heat exchange through the heat-conductive plate (17). An inwardly extending baffle (20a) is provided in the cooling head (5) above the heat-conductive plate (17) and covering a peripheral area of the heat-conductive plate (17) so that a rising current of the cooling medium derived from the jet (S) fed from the nozzle (19) and impinging on the heat-conductive plate (17) is converted to vortices (W) circulating between a central and peripheral area of the heat-conductive plate (17). With this structure, the cooling efficiency of the cooling head is improved and is more uniform over the entire surface of the heat-conductive plate (17).</p> |
