| 摘要 |
PURPOSE:To prevent interference between a wire and a capillary by a method wherein, when a ball is formed by heating the wire, the softening point of the wire is positioned just above the ball, and the wire is lifted from a first bonding portion toward the upward slanting part. CONSTITUTION:When a ball 1a is formed by heating one end of a wire 1, the softening point 1c of the wire 1 is adjusted so as to be positioned just above the ball 1a. A capillary 2 is made to descend on the pad 3a of a driving IC 3, and the ball 1a is crushed by the lower surface 2b of the capillary, thereby compression-bonding the wire 1 to the pad 3a. Next, the capillary 2 is made to ascend; the wire 1 is drawn out from a capillary-hollow-part 2a; a ceramic substrate 5 is moved; the wire 1 is bent just above the ball 1a, and lifted toward the upward slanting part from the pad 3a; the ceramic substrate 5 is moved; the capillary 2 is made to descend; the other end of the wire 1 is compression- bonded on a conductor pattern 4, and the wire 1 is cut. |
