| 摘要 |
PURPOSE:To eliminate a defective contact and the constraint of the space of pads, and to prevent the change of the performance of a large number of ICs by using a flexible printed wiring board. CONSTITUTION:A semiconductor integrated circuit device is composed by connecting a pad 22 for connecting a semiconductor chip 21 and the terminals 25 of a package by flexible printed wiring boards 26. Accordingly, wiring is conducted in two layers in the flexible printed wiring boards 26, thus preventing the generation of a contact accident, then positively keeping insulation, provided that a large number of pads can be shaped. The mutual relational positions of connecting wirings are also kept constant, the possibility of movement is eliminated, and the change of the performance of ICs is prevented. |
