| 摘要 |
Pin grid array has plate-like insulating support having oppositely facing first and second major surfaces. A plurality of first holes extend through the support on a first gird and a plurality of second holes extend through the support on a second grid which is displaced in the X and Y directions from the first grid. Each first hole contains a seamless socket contact and each second hole has mounted therein a post which extends beyond the second surface of the support. Each socket contact in a first hole is associated with a post mounted in an adjacent hole and a surface conductor extends from each socket contact to is associated post. The holes are plated through and the socket contacts are electrically connected to their associated posts by solder connections. A lower profile of the pin grid array when it is mounted on the circuit board is achieved along with other advantages.
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