| 摘要 |
A continuous method of forming a repetitive pattern on a metallized film substrate is disclosed as including the steps of continuously feeding a web of metallized film substrate at a predetermined web speed, selective dry removal of predetermined metallized areas from the metallized film substrate during continuous movement thereof, and collecting metallized dust and flakes removed from the metallized film substrate during the aforementioned dry removal of predetermined metallized areas from the metallized film substrate. Unlike existing wet systems which remove metallized areas from a metallized film substrate, the present invention employs selective dry removal, along with the collection of dust, in a continuous in-line system. Following the selective removal of metallized areas from the metallized film substrate, metallized dust is collected in a closed dust removal system providing removal, transport and collection of the metallized dust in a storage unit.
|
