| 摘要 |
<p>A metal core printed wiring board in which a large number of lead terminal such as of an IC or an LSI are formed by etching or the like method at an edge of at least one end of a conductive substrate that serves as a core, the core and the terminals are bonded together with an insulating bonding material maintaining electrical insulation, a conductive circuit pattern is formed directly on the surface of the insulating bonding material, or a printed board on which the wiring has been printed is adhered onto the surface of the insulating bonding material, in order to increase the density of mounting, to facilitate the connection to other circuit substrates such as mother boards, and to decrease the volume of circuit.</p> |
