发明名称 |
Apparatus and method for forming die sites in a high density electrical interconnecting structure |
摘要 |
The present invention is directed to a system for removing material from a structure. The system includes an excimer laser for removing material by ablative photodecomposition and means for increasing the energy density of the laser beam. The system further includes an aperture structure having a plurality of openings of different sizes and shapes. At least one of these openings may be selectively positioned in the laser beam. Additionally, the system includes a stage for supporting the structure wherein the stage is moveable in at least the x and y directions.
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申请公布号 |
US4940508(A) |
申请公布日期 |
1990.07.10 |
申请号 |
US19890371211 |
申请日期 |
1989.06.26 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
SHAMOUILIAN, SHAMOUIL;LUDWIG, PAUL N. |
分类号 |
B23K26/06;B23K26/36;H01L21/3213;H01L21/768 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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