| 摘要 |
PURPOSE:To eliminate product chip discrimination monitor chip and prevent reduction of the number of product chips by forming a monitor element having the same wiring structure as that of IC in the unused region of a chip and by checking it. CONSTITUTION:The monitor pad 3 and monitor element 4 for the IC wiring structure (A indicates step structure) are provided in the unused region in the vicinity of power supply pad 2 provided on the chip 1, and the terminals 5, 6 are connected to the pads 2, 3 through the power feeding paths 7, 8. The monitor element 4 is formed, for example, in such a way that the metal wirings 9 are stepped, on the substrate 11. When the element 4 is monitored using the pads 2 and 3, disconnection of wiring 9 to be generated on the IC can be detected and thereby adequacy of IC wiring structure can be judged. According to this structure, wirings of product chip can be checked without using the monitor chip by utilizing the unused region. |
