Installation of surface mount components on printed wiring boards

摘要

Movement of surface mount components during soldering onto TEFLON TM printed wiring boards is prevented by applying a strip of solder mask material to a solder pad to define a component lead area and applying solder to areas of the areas of the solder pad not covered by the solder mask strip. Solder paste is applied to the component bad area and the surface mount component is positioned with a lead in registry with the component lead area. The entire board is then heated to mechanically and electrically adhere the component lead to the pad.