SOLDERING PASTE FOR ELECTRONIC PURPOSES,申请号HU19880004910-传众专利搜索

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发明名称	SOLDERING PASTE FOR ELECTRONIC PURPOSES
摘要
申请公布号	HUT51947(A)	申请公布日期	1990.06.28
申请号	HU19880004910	申请日期	1988.09.20
申请人	REITER,ARPAD,HU	发明人	REITER,ARPAD,HU
分类号	B23K35/00;(IPC1-7):B23K35/00	主分类号	B23K35/00
代理机构		代理人
主权项
地址

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