发明名称 |
Three-dimensionally stacked LSI. |
摘要 |
<p>Disclosed is a three-dimensionally stacked LSI having a plurality of integrated-circuit layers stacked together, each of which is equipped with a plurality of circuit elements (2, 10, 16). Each of the circuit elements are equipped with a power terminal (4) of its own, which is connected through interlayer via-hole wiring (22) to the power wiring of the uppermost integrated-circuit layer. The power wiring of the uppermost integrated-circuit layer is formed of a metal exhibiting a low electrical resistance, for example, Al, whereas the metal wirings of the other layers, which are exposed to high temperatures when forming the upper layers, are formed of W.</p> |
申请公布号 |
EP0374971(A2) |
申请公布日期 |
1990.06.27 |
申请号 |
EP19890123906 |
申请日期 |
1989.12.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOMITA, YASUHIRO;TAKAGI, YOSHIYUKI;AKIYAMA, SHIGENOBU;YAMAZAKI, KENICHI |
分类号 |
H01L23/48;H01L23/528;H01L27/06 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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