Semiconductor wafer pick-up device.

摘要

This invention includes a device for picking up a semiconductor wafer without using the edges of the wafer thereby eliminating stress to the wafer. The picker moves up and down on a robotic arm and is caused to rest in the same location each time through the use of tapered posts. A circled array of tapered motor driven rollers center and find the flat edge of a semiconductor wafer by rotating the wafer until the flat edge is over a photo cell, at which time finder rollers secure the wafer in its centered and oriented position.