发明名称 |
THERMOSETTING RESIN COMPOSITION |
摘要 |
<p>Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis¢4(3-maleimidephenoxy)phenyl!propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and hightemperature stability.</p> |
申请公布号 |
CA1270998(A) |
申请公布日期 |
1990.06.26 |
申请号 |
CA19870541494 |
申请日期 |
1987.07.07 |
申请人 |
MITSUI TOATSU CHEMICALS, INCORPORATED |
发明人 |
YAMAYA, NORIMASA;KOGA, NOBUHITO;OHTA, MASAHIRO;YAMAGUCHI, AKIHIRO |
分类号 |
C08G73/12;(IPC1-7):C08G73/12 |
主分类号 |
C08G73/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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