| 摘要 |
PURPOSE:To perform the measurement of a check element after sealing a package from the outside of the package by connecting the check element to a stitch in an IC package by wire bonding and further, connecting the stitch the check conductors by internal wiring. CONSTITUTION:As each lead 3 is a flat package, it protrudes crosswise from the upper face of a substrate 1 which is equipped with IC chip, contact is just made easily to each end part of conductive members (check conductors) 11-13 from the outside and the other end part is connected to internal wiring 8 of the substrate 1 which is equipped with the IC chip. The IC chip 4 is die-bonded to a recessed part and further, is wire-bonded to a connection part (stitch) in the vicinity of the recessed parts of internal wiring regions 6 and 8 and then an internal wiring region 6 connecting to a wire 5 is an ordinary wiring region which is connected to the lead 3. Moreover, the internal wiring region 8 connecting to a wire 7 is wiring region which is connected to a check conductor 12. The measurement of a check element 10 of the chip is thus performed even after sealing the chip into the IC package. |
