LEAD FRAME, MANUFACTURE THEREOF AND WIRE BONDING METHOD,申请号JP19880313564-传众专利搜索

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发明名称	LEAD FRAME, MANUFACTURE THEREOF AND WIRE BONDING METHOD
摘要
申请公布号	JPH02158164(A)	申请公布日期	1990.06.18
申请号	JP19880313564	申请日期	1988.12.12
申请人	MITSUBISHI ELECTRIC CORP	发明人	NAKAI MASARU
分类号	H01L21/60;H01L23/50	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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