| 摘要 |
PURPOSE:To easily form a film by a simple method without masking, etc., by coating the surface of a printed wiring board with photosensitive ink, blowing pressurized gas to a through hole part to remove the ink of the hole part, and then curing the ink. CONSTITUTION:Ink 3 as a photosensitive film is formed on a through hole board 1. Thereafter, the substrate 1 is reversed upside down, and moved on a conveying roll 6. An air knife 4 is disposed above the board 1 moving on the roll 6 in a direction A. Pressurized gas 5 is blown from above to a through hole 11 in a direction B. Solvent for the ink 3 is vaporized and contained in the gas 5. The ink 3 on the board 1 is so heated by a heater 75 in the degree as to soften it. Ink 31 in the hole 11 is blown downward by the gas 5. Since the ink 31 is lowered in its viscosity, i.e., softened because of the heating, it can be easily removed. Since the solvent of the ink 3 is contained in the gas 5, it can be further easily removed. |
