发明名称 |
MOLDING OF PLASTIC |
摘要 |
After applying powder of thermoplastic or themosetting resin on surface of a moulding die by electrostatic plating, material resin is charged to form a prod. with electroconductive film of its surface. The mould is preheated, and the preheating temp. is melting pt. of the powder resin +10 deg.C at least and is at least the softening pt. of the powder resin. The powder resin is mfd. according to wet-type granulating method to granulate mixt of water soluble solvent. The resin is insol. in water and soluble in the solvent. The electroconductive powder is metal powder of dendrite form.
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申请公布号 |
KR900003733(B1) |
申请公布日期 |
1990.05.30 |
申请号 |
KR19850008104 |
申请日期 |
1985.10.31 |
申请人 |
DAINIPPON TORYO KK;TOKAI KOGYO CO LTD |
发明人 |
SAKAKIBARA TAKAO;TOYODA TSUNEHIKO;NAGASHIMA YOSHIHISA |
分类号 |
H01C1/02;B05D7/02;B29C37/00;B29C41/00;B29C45/14;B29C45/16;B29C49/24;B29C51/10;B29C51/26;B29C70/88;B29L9/00;C08J7/04;H01B5/00;H01B5/14;H01L21/56;(IPC1-7):B29C45/16 |
主分类号 |
H01C1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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