发明名称 MOLDING OF PLASTIC
摘要 After applying powder of thermoplastic or themosetting resin on surface of a moulding die by electrostatic plating, material resin is charged to form a prod. with electroconductive film of its surface. The mould is preheated, and the preheating temp. is melting pt. of the powder resin +10 deg.C at least and is at least the softening pt. of the powder resin. The powder resin is mfd. according to wet-type granulating method to granulate mixt of water soluble solvent. The resin is insol. in water and soluble in the solvent. The electroconductive powder is metal powder of dendrite form.
申请公布号 KR900003733(B1) 申请公布日期 1990.05.30
申请号 KR19850008104 申请日期 1985.10.31
申请人 DAINIPPON TORYO KK;TOKAI KOGYO CO LTD 发明人 SAKAKIBARA TAKAO;TOYODA TSUNEHIKO;NAGASHIMA YOSHIHISA
分类号 H01C1/02;B05D7/02;B29C37/00;B29C41/00;B29C45/14;B29C45/16;B29C49/24;B29C51/10;B29C51/26;B29C70/88;B29L9/00;C08J7/04;H01B5/00;H01B5/14;H01L21/56;(IPC1-7):B29C45/16 主分类号 H01C1/02
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