发明名称 Method for electroplating a conducting surface
摘要 PCT No. PCT/EP87/00433 Sec. 371 Date Feb. 9, 1989 Sec. 102(e) Date Feb. 9, 1989 PCT Filed Aug. 7, 1987 PCT Pub. No. WO88/03183 PCT Pub. Date May 5, 1988.A process for galvanic coating of a selected area on a preform, comprising applying an electrically conducting metallic primer to substantially the entire surface of the preform; masking a portion of the surface coated leaving exposed an unmasked portion not to be coated; forming a clear coat to the exposed portion not to be galvanized; removing the mask to expose the portion of the surface not clear coated; and galvanically coating the area of metallic primer.
申请公布号 US4929315(A) 申请公布日期 1990.05.29
申请号 US19890328033 申请日期 1989.02.09
申请人 AUDI AG 发明人 SCHAPER, SIEGFRIED;SEUFERT, MARTIN
分类号 B60B7/02;C25D5/02;C25D5/56 主分类号 B60B7/02
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