| 摘要 |
PURPOSE:To make the fine crack content become about 1/100 or below in comparison with that of the conventional mainframe of elements by introducing a process in such a way that the fine cracks developed in the mainframe of the elements are selected by an adequate load applied to the mainframe of the elements when a process for mounting lead terminals to the mainframe part of the elements is performed. CONSTITUTION:In the case where a process for mounting respective lead terminals 14, 15, and 17 to a piezoelectric vibrating element 11 is performed, an adequate load is applied by three pieces of presser pins, in other words, by two pieces of them from the rear side and by a piece of its pin from the surface side. If a crack (a) is found in the foregoing element 11, it results in giving damage to the element 11. Such defective piezoelectric vibrating elements are removed by reading mechanical changes due to such cracks through electrical signals. Thus defective elements are not included in subsequent processes. |
