| 发明名称 |
CONNECTION TO A COMPONENT FOR USE IN AN ELECTRONICS ASSEMBLY |
| 摘要 |
MP1282 A connection to a contact on an electronic component is made by means of a solder preform in the form of a column, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.
|
| 申请公布号 |
CA2002927(A1) |
申请公布日期 |
1990.05.14 |
| 申请号 |
CA19892002927 |
申请日期 |
1989.11.14 |
| 申请人 |
SVENDSEN, LEO G.;LEARY, REBECCA A.;GESCHWIND, GARY I. |
发明人 |
SVENDSEN, LEO G.;LEARY, REBECCA A.;GESCHWIND, GARY I. |
| 分类号 |
B23K35/02;H01L23/498;H05K3/34;(IPC1-7):B23K3/00 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
