发明名称 OXYGEN-MIXING ETCHING METHOD AND SPRAY-TYPE ETCHING DEVICE USED THEREFOR
摘要 PURPOSE:To smoothly and stably perform etching by quantitatively sending gaseous oxygen into a cupric chloride-based etchant immediately before the etchant is sprayed on a member to be etched. CONSTITUTION:Since gaseous oxygen is quantitatively supplied to the etchant 2, an anionic complex, etc., are not formed, and cuprous oxide scales can be smoothly dissolved as cupric ion. As a result, etching is smoothly and stably carried out, and a clear etched surface is obtained. The gaseous oxygen is supplied to the etchant 2 immediately before the etchant 2 is sprayed. Accordingly, the gas unneeded by the dissolution reaction in etching is discharged into the atmosphere simultaneously with the spraying of the etchant. As a result, the unneeded gas is not mixed into the etchant 2 to be circulated and used, the function of a pump is not deteriorated, and the etchant 2 can be stably circulated and sprayed.
申请公布号 JPH02115383(A) 申请公布日期 1990.04.27
申请号 JP19880265539 申请日期 1988.10.21
申请人 DAINIPPON PRINTING CO LTD 发明人 SAGARA HIDEJI
分类号 C23F1/08;C23F1/18;H05K3/06 主分类号 C23F1/08
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