| 摘要 |
PURPOSE:To prevent an insulating state of an electrical route to an internal circuit when an electrode on a ship is corroded by a method wherein a bonding wire used to connect an electrode on the side of a package to the electrode on the chip is bonded to a surface-protective film in a part where the electrode on the chip is contacted closely. CONSTITUTION:A surface-protective film 8 is formed so as to encroach on one part of a bonding part between a bonding wire 6 and an electrode 7 on a chip. In order to expand a bonding area between the bonding wire 6 and the electrode 7 on the chip 9 and to enhance a bonding effect, a part on which the surface-protective film 8 encroaches and a part on which the film does not encroach are structured so as to be mixed in the bonding part. For example, when an impurity or the like which corrodes the electrode 7 on the chip 9 penetrates from the outside, the surface-protective film 8 protects the electrode 7 on the chip 9 from the impurity or the like at least at four points. Thereby, a conductive state of an electrical route from the bonding wire 6 to an internal circuit is guaranteed. |
