| 发明名称 |
CERAMIC WIRING SUBSTRATE AND PROCESS FOR PRODUCING THE SAME |
| 摘要 |
A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate. |
| 申请公布号 |
EP0230675(A3) |
申请公布日期 |
1990.04.25 |
| 申请号 |
EP19860118173 |
申请日期 |
1986.12.31 |
| 申请人 |
HITACHI, LTD. |
发明人 |
TODA, GYOZO;KUROKI, TAKASHI;ISHIHARA, SHOUSAKU;FUJITA, TSUYOSHI;KANDA, NAOYA |
| 分类号 |
H01B5/14;H01B1/16;H01B13/00;H01L21/48;H01L23/15;H05K1/03;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H01L23/14 |
主分类号 |
H01B5/14 |
| 代理机构 |
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