发明名称 MOUNTING OF FLAT TYPE ELECTRONIC COMPONENT
摘要 PURPOSE:To make it possible to set the printing positions of a solder with a high accuracy end to facilitate the printing of a printing solder by a method wherein recessed parts are formed in the surface of a printed board, the cream solder is printed there and the leads of an electronic component are respectively soldered to the recessed parts. CONSTITUTION:Recessed parts 4 are respectively formed at places, where a flat type electronic component 11 is mounted, of a printed board 11, that is, at positions, where correspond to leads 12 of the component 11, of the surface of the board 11. Moreover, wiring patterns 2 which are formed on the surface of the board 1 are formed in such a way that they are each extended to at least the inside, faces of these recessed parts 4. Accordingly, in case a cream solder 3 is printed only in the interiors of the recessed parts 4, the solder 3 has only to be printed only in the recessed parts 4 and a special-purpose jig and a highaccuracy positioning become unnecessary. Thereby, the printing work of a solder can be simplified and a positional deviation in the mounting of the component 11 is prevented.
申请公布号 JPH02113594(A) 申请公布日期 1990.04.25
申请号 JP19880266571 申请日期 1988.10.22
申请人 NEC CORP 发明人 ARIGA KATSUAKI
分类号 H05K1/18;H05K3/34;H05K3/40 主分类号 H05K1/18
代理机构 代理人
主权项
地址