| 摘要 |
<p>PURPOSE:To prevent a wire from flowing by a method wherein a semiconductor element is sealed with a thermosetting resin together with a bonding wire and an inner lead via an insulating film with which the surface of the bonding wire connecting an electrode of the semiconductor element to the inner lead is covered. CONSTITUTION:The following are contained: a semiconductor element 1 mounted on an island 2a of a lead frame; a bonding wire 3 connecting its electrode pad to an inner lead 2b of the lead frame; an insulating film 4 formed so as to cover this wire 3; a thermosetting resin 5 sealing these. A coating operation of the surface of the wire 3 by the insulating film 4 is completed in such a way that the wire 3 after a wire bonding operation is covered with the insulat ing film 4 and that this film is heated to 200 deg.C or higher by using an infrared heater and is bonded to the wire 3.</p> |
