PROCESSO PARA SUPRIMENTO DE PERCURSOS CONDUTORES METALICOS SUPERPOSTOS OU ENCAPSULADOS EM SUBSTRATO DIELETRICO OU SEMELHANTES

摘要

A method of forming successive metal layers of varying widths on a substrate is disclosed. A mask having a through going aperture is provided, the mask including a constricted neck portion between its upper and lower surfaces. Successive metal layers are applied over the substrate through the aperture in the mask sequentially by sputtering methods which form a metallic layer wider than the constricted neck portion of the mask and by vapor deposition method which forms a narrower metal layer corresponding to the transverse dimension of the constricted portion of the mask.