| 摘要 |
<p>PURPOSE:To finish a resin treatment at one time, to dispense with a cutting of a supporting arm as well and moreover, to obtain a semiconductor device having no bubble and sag on the surface of a resin by a method wherein a semiconductor element, an element installing part and a supporting component to support these of the element and the installing part are molded with the resin and at the same time, the component is provided in such a way as to reach the surface of the resin. CONSTITUTION:A semiconductor element 7 is installed on an element installing part 5 and with the element 7 connected to wire bonding parts 8A and 8B by wires 9, a supporting component 16 is fitted into a round hole 6 of the installing part 5. The diameter of the component 16 is a diameter which is just fitted into the hole 6. When the installing part 5 is set on a mold, both ends 19 in the axial direction of the component 16 respectively just reach a top force and a bottom force and are respectively abutted on these forces. As the part 5 is supported by the component 16 and a lead 4B in the mold, the valiability of the position of the part 5 is little. These of the element 7, the part 5 and the component 16 are molded with a resin 11. As both ends 19 of the component 16 are abutted on the mold, the component 16 reaches a mounting surface 13 of the resin 11 and a surface 20 on the side opposite to the surface 13 when being molded. Subsequently, a tie bar 10 and a side 2 are cut and removed and a semiconductor device is completed. As there is no supporting arm like that in a conventional embodiment, a bonding of resin is not necessary.</p> |
