| 摘要 |
<p>PURPOSE:To prevent breakdown and line disconnection due to corrosion under a corrosion environment by proving a bending section that guaranties the difference in the thermal expansion coefficients of a copper-foil pattern lead and resin so that an inner lead section protrudes on the semiconductor device side. CONSTITUTION:Bending is performed so that the inner lead 31 of a copper-foil pattern lead 11 protrudes at a semiconductor device side 14. Using the copper- foil pattern lead on which bending is performed. an inner lead 31 and the electrode of the semiconductor device 14 are connected and sealed with resin 7. Because of the bending, distortion (stress) caused by the difference in the thermal expansion coefficients of the pattern lead 11 and resin 7 can be absorbed in the bending section of the pattern lead 11. As a result, the breakdown of the inner lead 31 due to change in temperature and corrosion breakdown under a corrosion atmosphere can be prevented.</p> |
