| 摘要 |
PURPOSE:To make it possible to determine how the end face of an ingot from which a wafer has been cut off is corrected by a blade, by measuring degrees of warpage of the ingot in the cut direction and in the direction orthogonal thereto and determining configurations of the end face and degrees of warpage from predetermined reference data. CONSTITUTION:Three projections 4, 5 and 6 to be abutted on the end face 7 of an ingot are provided on the top face of a T-shaped measuring member 3 while a probe 8 of a displacement detector 8 is placed at the center between the projections 4 and 5. The probe 8 measures an amount of displacement in the orthogonal direction to the plane defined by the tips of the three projections 4, 5 and 6 and determines how the central part is warped in relation to the diametral direction. If values of X and Y are in an acceptable range, it is determined that the ingot has been cut in a desirable state. The configurations of the desirably cut end face of the ingot are classified into three basic groups and these data are previously stored in a computer for example. The measurement values are compared with the stored data and most approximate configurations corresponding thereto are displayed.
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