METHOD FOR POLISHING A SILICON WAFER,申请号EP19890110984-传众专利搜索

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发明名称	METHOD FOR POLISHING A SILICON WAFER
摘要
申请公布号	EP0348757(A3)	申请公布日期	1990.03.07
申请号	EP19890110984	申请日期	1989.06.16
申请人	JAPAN SILICON CO., LTD.;SONY CORPORATION	发明人	SAITO, YUICHI;SAKAI, SHINSUKE;HAYASHI, HISAO;MATSUSHITA, TAKESHI
分类号	B24B37/04;H01L21/306;(IPC1-7):B24B9/06	主分类号	B24B37/04
代理机构		代理人
主权项
地址

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