| 摘要 |
PURPOSE:To improve the quality of preparatory soldered parts and to eliminate the need for a removing process by a method wherein a lead wire is longitudinally moved in swelled fused solder or in the bulge of dangled fused solder in dripped shape, and solder is adhered to the lead wire. Therefore, fluxes, therefuse of a coating material, soldering waste are not adhered to boundary parts. CONSTITUTION:Moving devices 13 operate to return to the original position by vertically moving each fusing soldering growth device 11. A crossover track 10c is immersed in fused solder 16 at the time of raising each device 11, and solder is adhered to the crossoven track 10c by horizontal movement. The adhering ranges correspond to the moving distance of the device 11, and the part between (e) section and (f) section and that between (g) section and (h) section are the adhering range of solder. String solder 15 is operatively moved back so as not to disturb the movement of the device 11. A cutting device 21 provided with two cutters 20, 20 is positioned between stations D, E, and the crossover track 10d moves in the arrow direction to cut the crossover track 10d. In this way, a coil 9 having the lead wire 10 providing preparatory soldering from the (e) section and (g) section to the tip is obtained at station F. |
