| 摘要 |
<p>PURPOSE:To inhibit the generation of a package crack due to a thermal shock by adopting electromagnetic wave irradiation as a heating means in the melting process of a solder material and installing an electromagnetic-wave reflecting plate onto a package surface in the direction that the package surface receives electromagnetic wave irradiation when a resin seal type semiconductor device is brazed and mounted. CONSTITUTION:A previously prepared electromagnetic-wave reflecting plate 7 is superposed onto the electromagnetic-wave irradiating surface of a resin package body, and the solder material sections of outer leads 2 are irradiated with electromagnetic waves, thus heating, melting and mounting the solder materials. Consequently, even when electromagnetic waves are applied and the solder materials are heated at a melting temperature or more, the temperature rise of a package can be inhibited. Accordingly, the generation of a package crack due to a thermal shock can be suppressed.</p> |
