| 摘要 |
PURPOSE:To prevent the prepreg of a bonding agent from being eluted out of a through-hole section so as to obtain a wiring board of high quality by a method wherein a wiring pattern is formed, except on the lid which covers the through-hole section, using the etching resist of permanent resist. CONSTITUTION:A copper plated laminar board 1, which is to be serve as an outer layer member, is subjected to a hole boring process to form a through-hole 2. The outer layer member is copper-plated to make the through-hole 2 plated with a copper coating 3. A pattern is formed after a dry film resist 4 has been pasted on the outermost layer and a photosensitive solder resist 5 has been pasted on the face of the inner layer. A previously patterned inner layer member 20 is sandwiched in between outer layer members 20 through the intermediary of prepregs 7 in layers. The above laminated body is heated and pressed by a laminating press to be formed in a solid structure. By this setup, the prepreg resin of a bonding agent is prevented from being eluted out of the through-hole 2, so that a wiring board of high quality can be obtained. |
