| 摘要 |
PURPOSE:To obtain the title chip capacitor having excellent heat-resisting property and requiring no soldering device by a method wherein, after a lead type chip capacitor having a junction layer made of high melting point metal paste, an inner electrode and a lead terminal have been adhered using metal paste, they are dried up at the prescribed temperature, and the chip capacitor is fired at the prescribed temperature in the air. CONSTITUTION:Metal paste is composed of metal powder and an organic binder. The metal or metal alloy powder such as Ag, Cu, Ag/Pd, Pt and the like is used as the metal powder to be used as the main component of the metal paste. Also, the high molecular substances such as the celluloses of methylcellulose and the like and polyethylene and the like are used as the organic binder. After the inner electrodes located at both ends of a capacitor chip and a lead terminal have been adhered using the metal paste, they are dried up at 100 to 200 deg.C. As a result, the lead terminal is adhered to both ends of the capacitor chips. Subsequently, the chip is fired at 500 to 900 deg.C for 0.5 to 2 hours in the atmospheric air or in a nitrogen atmosphere. As a result, the lead terminal can be firmly junctioned without impairing the characteristics of the capacitor chip. |
