| 摘要 |
PURPOSE:To identify easily mutual interlayer position slippages with an X-ray fluoroscopic apparatus or with a visual method as well by mounting reference patterns in company with measuring patterns on each one side and each other side of circuit printed boards which are put in layers so that both the reference patterns and the interlayer position slippage measuring patterns may collate each other states of the above boards which are put in layers. CONSTITUTION:A collation pattern is formed on the principle of vernier calipers. In other words, reference patterns 24a-24e are formed to have 20 scale marks graduated by 1mm and measuring patterns 25a-25e for interlayer position slippages are formed to have 20 scale marks which are marked out in equal increment and are graduated by 19mm. When each printed board is put on top of another one by using these patterns, each interlayer position slippage pattern is put on top of each reference pattern which is mounted at the corner insulating part of a lowermost printed board and the same step is taken for each other printed board. Four corners of each printed board are thus measured to find its interlayer position slippage. |
