| 摘要 |
PURPOSE:To make the increase of reactance minimum and the resistance value of a damping resistor small by a method wherein the damping resistor is built in a light emitting element driving semiconductor device. CONSTITUTION:A damping resistor 3 is provided onto a semiconductor chip 1 where a light emitting element driving semiconductor device is formed, and one end of the damping resistor 3 is directly connected to a collector electrode 2. An output electrode 4 is provided to the other end of the damping resistor 3, which functions as a wire bonding pad. A light emitting element 5 is connected to the output electrode 4 through a bonding wire 6, and the light emitting element 5 is wire-bonded to the output electrode 4 only at a point. By these processes, the reactance can be decreased and a light emitting element can be also driven better. |
