| 摘要 |
PURPOSE:To enable face down mounting on a semiconductor chip having electrode pads without forming a connecting metallic projection by using metallic balls as connecting materials. CONSTITUTION:Resin paste 3 is formed by printing on metallic patterns 22 for connecting with a semiconductor chip 7 installed on the surface of a heat resisting insulating substrate 1 to mount the semiconductor chip 7 thereon and metallic balls 4 are stuck at the same height on the resin paste 3, directly connected with both the metallic patterns 22 for connection on the surface of the substrate 1 and electrode pads 21 on the semiconductor chip 7, and pressurized and heated. Therefore, metal and metal are substantially connected with each other. This enables easily mounting a semiconductor by face down bonding method. |
