发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent a bonded part from peeling off and suppress dispersion of tail lengths by cutting a wire by moving a tool backward with a clamp closed after bonding at a second bonding point. CONSTITUTION:After a wire 5 is bonded at a second bonding point, a tool 3 is moved backward with a clamp 4 closed to cut the wire 5. Therefore, force upward will not act on the wire 5 to prevent the bonded part of the wire 5 from peeling off. After the tool 3 is raised and the wire 5 is sent out of the tip of the tool 3, the sent-out part of the wire 5 is shaped by bending by moving the tool 3 diagonally to the lower behind to always obtain tails of a constant length equal to the length of the sent-out part. This prevents the bonded part from peeling off and suppresses dispersion of the lengths of the tail at the tip of the tool.
申请公布号 JPH0228338(A) 申请公布日期 1990.01.30
申请号 JP19880178418 申请日期 1988.07.18
申请人 NEC CORP 发明人 TOGASHI KOICHI
分类号 H01L21/60 主分类号 H01L21/60
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