| 摘要 |
PURPOSE:To make it possible to remove easily an IC chip from a substrate by a method wherein heat and ultrasonic vibrations are applied to the IC chip to weaken the adhesive force of a resin for solidifying the IC chip to the substrate and the residual part of the IC chip and the resin are removed from the substrate. CONSTITUTION:The point of a trowel 4 is brought into contact to an IC chip 1 fixed on a substrate 2 with a fixing resin 3 and heat and ultrasonic vibrations, desirably both are applied simultaneously to the chip to weaken the adhesive force of the resin 3. Thereby, the chip 1 and the resin 3 are easily removed from the substrate 2 by tweezers or the like. |
