| 摘要 |
PURPOSE:To eliminate the greater part of an expensive metal film of a die attachment part by applying an annular metal film on the inside of an inner lead on the circumference of a die attaching part of an IC chip. CONSTITUTION:An annular metal film 8 is partially formed on the ceramic insulating part 9 between an inner lead 6 a die attachment 3. A sintered metallized layer such as tungsten and molybdenum on the part for applying a metal film is formed on the ceramic of a ceramic package and a metal film is formed by Ni and Au thereon selectively. Thus, after the metal film 8 is formed, Ag paste 4 is stuck on the die attachment 3 to attach an IC chip thereto, the Ag paste is dried at 150 deg.C for about an hour to solidify and the die attachment 3 and the IC chip 1 are fixed completely. The metal film 8 performs its duty of a bank and resin constituents in the Ag paste 4 do not reach the inner lead 6.
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