| 摘要 |
<p>The articles of this invention have increased resistance to moisture induced delamination at a bond line comprising a substrate, a second layer and an adhesive. The increased resistance to moisture and increase in bond strength between the adhesive, the substrate and the second layer is produced through a novel adhesive. The adhesive after spraying cools to below the softening point of the components but retains sufficient liquidity to fully wet or to penetrate the second layer causing the layers to be bonded to the film substrate through intimate adhesive bonds or by bonding through a physical entrapment. The physical entrapment of the nonwoven layer substantially prevents moisture-induced debonding or delamination.</p> |
