发明名称 TERMINAL LAND OF HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To prevent solder from covering over a through hole and to realize stable quality by providing a slit to a terminal land which is made around the through hole and by applying an overcoat of solder onto the terminal land. CONSTITUTION:As a pattern structure of a terminal land 3 of a hybrid integrated circuit, a slit 6 is provided to the terminal land which is made around a through hole 1, and an overcoat of solder 4 is applied onto the terminal land. The slit provided to the terminal land prevents the solder from covering over the through hole, thus applying an overcoat of solder onto the terminal land alone.
申请公布号 JPH027493(A) 申请公布日期 1990.01.11
申请号 JP19880157057 申请日期 1988.06.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 AOYAMA YOSHIKAZU;TANAKA KAZUTOSHI
分类号 H05K3/34;H05K1/11;H05K3/40 主分类号 H05K3/34
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