发明名称 |
TERMINAL LAND OF HYBRID INTEGRATED CIRCUIT |
摘要 |
PURPOSE:To prevent solder from covering over a through hole and to realize stable quality by providing a slit to a terminal land which is made around the through hole and by applying an overcoat of solder onto the terminal land. CONSTITUTION:As a pattern structure of a terminal land 3 of a hybrid integrated circuit, a slit 6 is provided to the terminal land which is made around a through hole 1, and an overcoat of solder 4 is applied onto the terminal land. The slit provided to the terminal land prevents the solder from covering over the through hole, thus applying an overcoat of solder onto the terminal land alone.
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申请公布号 |
JPH027493(A) |
申请公布日期 |
1990.01.11 |
申请号 |
JP19880157057 |
申请日期 |
1988.06.25 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
AOYAMA YOSHIKAZU;TANAKA KAZUTOSHI |
分类号 |
H05K3/34;H05K1/11;H05K3/40 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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