| 摘要 |
PURPOSE:To transfer a semiconductor device such as a solid-state image sensing device, an EPROM or the like without contaminating a glass cap used for the semiconductor device by a method wherein the glass cap for semiconductor use is sandwiched between two sheets of plastic films and the plastic films are bonded and sealed. CONSTITUTION:A glass cap 1 whose both lower edges are coated with a sealing adhesive 4 is sealed between two sheets of plastic films 2; inner faces of the plastic films 2 are coated in advance with a pressure sensitive adhesive 3 (only one face is acceptable). In addition, when the glass cap 1 is coated in advance with the sealing adhesive 4, it is not required to coat the sealing adhesive on a part to which a package is attached when the cap is attached to the package. Thereby, it is possible to house, transfer and store glass caps without contaminating the light-transmitting glass. |
