| 摘要 |
<p>PURPOSE:To eliminate the curvature of an IC card so as to protect an electronic component against damage and the defective connection and prevent the IC card from deteriorating in strength by a method wherein the IC card is possessed of a three-layered structure that is composed of an intermediate layer formed of a light and hard material and metal layers attached to both the sides of the intermediate layer. CONSTITUTION:An IC module is provided inside a card base material of a laminar body, which is composed of an intermediate layer 14 of resin material and metal outer layers 15a and 15b, to form an IC card. The material of the intermediate layer 14 is a light and hard plate of resin such as BT resin, glass cloth resin, glass epoxy resin or the like, and an IC module burying hole is provided to it. The outer layers 15a and 15b are formed of a metal plate comparatively high in rigidity such is a SUS 304 stainless steel plate or the like and bonded to the intermediate layer of resin material through a bonding agent. Therefore, even if an external stress is applied onto the IC card, the curvature of the IC card itself is prevented, so that a wire which connects an IC chip 20 with an IC card printed wiring board is protected against disconnection and the IC chip inself can be protected against damage.</p> |
