| 摘要 |
<p>PURPOSE:To seek to decrease exclusive area of a passive element such as a resistor, etc., so as to miniaturize a substrate by incorporating a resistor or a dielectric into a hole part which is opened to perform wiring between layers of a circuit substrate consisting of multilayer. CONSTITUTION:Three alumina green sheets 11-13 are prepared, and via holes 14-16 are formed at a specified position of sheet 11 positioned at the uppermost layer. And conductor paste 17 is filled in the via hole 15 by screen printing. Next, resistor paste 18 and 19 is filled in the via holes 14 and 16 by a screen printing method. Next, similarly the specified patterns of conductor paste 20 and 21 are printed on the surface of each sheet 11-13 by the screen printing. And each sheet is pressed in the laminated condition and force-bonded. Thereafter, force-bonded each green sheet 11-13 is baked. As a result, a hybrid integrated circuit is formed, in which resistors 18 and 19 are incorporated in the via hole parts 14 and 16 to perform wiring between layers of alumina substrates 22-24 consisting of multilayer. Hereby, it becomes possible to decrease exclusive area of a passive element such as a resistor, etc., on the layer and miniaturize the substrate.</p> |
