| 摘要 |
PURPOSE:To obtain an excellent circuit wiring board, by a method wherein, after a plurality of ceramic green sheets, on which each prescribed circuit pattern is formed by using conductor paste, are laminated and fixed by pressure, sequential cutting in the sectional direction is performed so as to obtain cut segments with a specified thickness, and thin said cut segments are fired. CONSTITUTION:Specified circuit patterns are formed respectively on a plurality of ceramic green sheets 1a, 1b, by using conductor paste 2, and a plurality of said green sheets 1a, 1b are laminated and fixed by pressure. After that, the green sheets 1a, 1b, which are laminated and fixed by pressure, are cut in order in the sectional direction, and a plurality of cut segments are made. By firing these cut segments, organic material in the green sheets 1a, 1b, and conductor 3 is decomposed and eliminated, and the ceramic 1a, 1b and the conductor 3 are fired. Since the section is utilized as the circuit wiring part in this manner, the conductor width practically corresponds to the thickness of the conductor, and the conductor gap practically corresponds to the thickness of the green sheet. Thereby, an excellent circuit wiring board is obtained. |
