| 摘要 |
A cooling system for a cathodic sputtering target comprises a cooling liq. circuit including an opening adjacent the back of the target and an arrangement for isolating the circuit from the interior of the vacuum chamber, the novelty being that a metallic membrane is fixed (pref. welded or brazed) hermetically to the edge of the opening. USE/ADVANTAGE - The system is esp. useful in rapid sputtering processes for cooling targets of low melting pt. metals, low thermal conductivity metals or reactive metals. It provides the advantages of direct water cooling while avoiding any risk of contact of the water circuit with the vacuum chamber and diffusion of water vapour into the chamber through organic seals.
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